Thermafoil TIM Thermal Interface
Thermafoil® Thermal Interface Material (TIM) is a component designed to rapidly transfer heat away from delicate electronics. An anisotropic or directional material, TIM exhibits a 25 percent improvement in thermal conductivity when compared to isotropic materials and transfers heat from irregular loading, surface distortion and uneven temperature distribution. It also allows heat “sinks” to realize their maximum operating temperature. The end result is cooler operation and improved efficiency.
50# 100 W/mºC (in-plane); 7 W/mºC (through plane)
70# 140 W/mºC (in-plane); 5 W/mºC (through plane)
90# 180 W/mºC (in-plane); 4 W/mºC (through plane)
Values are typical and can vary.
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